Laser-Direct-Structuring (LDS)

Selective plating of injection molded components by laser-direct-structuring in only three process steps.

Fields of Application

  • Telecommunication
  • Antenna technology
  • Office technology / data systems technology
  • Automotive industry
  • Plug-in connector industry

Plastic-Combinations

  • ABS = acrylonitrile-butadiene-styrene
  • LCP = liquid crystal polymer
  • PBT = polybutylene terephthalate (cross-linked by irradiation)
  • PPA = polyphthalamide
  • PEI = polyetherimide
  • PA = polyamide
  • PC = polycarbonate

Dimensions

  • Minimum PCB-track width 100 µm
    (up to 50 μm is possible with a new laser)

Advantages

  • Low tool costs
  • Quick layout changes are possible
  • Very fine structures are possible
  • Parts are solderable

Disadvantages

  • Only 2.5-D is possible
  • Longer plating process
  • Only high temperature resistant materials are applicable

Additive-Procedure

  1. Complete plating with electroless copper
  2. Laser structuring
  3. Contacting the layout surfaces – galvanized enhancement to 20-30 µm
  4. Differential etching (removal of the electroless copper layer)
  5. Final surface e.g. electroless nickel/gold

Subtractive-Process

  1. Complete plating with electroless copper
  2. Complete plating with galvanized copper and galvanized tin
  3. Laser structuring (only removes the tin layer)
  4. Copper etching
  5. Tin stripping
  6. Final surface e.g. electroless nickel/gold